Chips and hardware · Companies and people
Huawei pulled the Ascend 960DT launch forward by three quarters
This story was corrected after publication (Oct. 9, 2026). Details
The company announced it at Huawei Connect in Shanghai: the chip now arrives in the first quarter of 2027 instead of the fourth, and the Ascend 960PR moves up by one quarter. Trump and Xi meet in Washington on September 24 with AI high on the agenda. Rotating chairman Eric Xu’s own admission balances the picture: Huawei cannot currently build enough AI computing equipment to meet demand in China.
Sources
- Huawei, “Advancing the Agentic World, Building a Solid Silicon Foundation”, (huawei.com)
- Huawei, “Groundbreaking SuperPoD Interconnect: Leading a New Paradigm for AI Infrastructure”, (huawei.com)
- Reuters, “China’s Huawei says AI chip demand outstrips supply as it steps up Nvidia challenge”, (reuters.com)
- Bloomberg, “Xi-Trump Summit Agenda: AI, Tariffs, Critical Minerals, Iran War, Taiwan”, (bloomberg.com)
Corrections and updates
- The version first posted on Instagram said the chip would arrive in the first quarter of 2027 instead of the third. Huawei’s original roadmap had it in the fourth quarter of 2027; the text has been corrected.
About this story
This story was posted on Instagram by @jarrus.tech on Sept. 21, 2026.
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Short link: thejarrus.com/en/h6-25
This story in Turkish: Huawei, Ascend 960DT lansmanını üç çeyrek öne çekti
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